Description

Product Description:
Cu/Mo*0Cu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo**-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu:Mo-Cu:Cu is 1:4:1. It has different CTE in X and Y direction, higher thermal conductivity than that of W(Mo)-Cu,Cu/Mo/Cu and more cheap. All types of Cu/Mo*0Cu/Cu sheets can be stamped into components.

Features:
Large sized sheets available (length up to **0mm, width up to **0mm)
More easily to be stamped into components than CMC
Very strong interface bonding which can repeatedly resist **0ºC heat shock
Higher thermal conductivity and lower cost
No magnetism

Product information: