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|Minimum Order
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Price for Minimum Order:
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Packaging Detail:
It depends on the actual design and different customized speciffications
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Other, D/A, L/C, T/T
Taiwan
Contact Person Mr. Reg
Jhongshan RD, Hsinchu, Hukou
Ceramic metallized: Ti/W,gold(Au),
sliver(Ag),Copper(Cu),nickel(Ni), (AL) and others & produce
final circuit
coating:0.**5um to 5mil
Ceramic Metallized substrate:
Al2O3 substrate metallized
AlN substrate metallized
Silicon wafer metallized
LED heat-dissipation ceramic substrate:
LED Al2O3 thin film substrate
LED Al2O3 thick film substrate
LED AlN thin film heat-dissipation substrate
Flip chip substrate:
The integration of the thin film,thick film,electrode plating and electroless plating processes:
Application:
1. High Power LED ceramic substrate
2. Microwave (Wireless Communication & Radar)
3. Semiconductor Process Equipment
4. Solar Cell
5. Hybrid Electric Vehicles
6.Flip chip/eutectic substrate
7.Sensor ceramic substrate