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Hot sales new products BLE bluetooth module with factory price

Hot sales new products BLE bluetooth module with factory price

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2 ~ 3 / Piece

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Minimum Order

Place of Origin:

-

Price for Minimum Order:

Minimum Order Quantity:

1000 Piece

Packaging Detail:

box

Delivery Time:

5-7 days

Supplying Ability:

1000000 Piece per Day

Payment Type:

T/T

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Contact Person sophia

Block C, Phase 1, Smart Home, No. 76 Baohe Avenue, Baolong Street, Longgang District, Shenzhen City, Shenzhen, Guangdong

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Description

Product Model:HY**0R**4S1C

Size: *1.5*9.0*2.0mm

Modulation Mode:GFSK

Antenna Type: Ceramic antennas

Bluetooth BLE 5.0 single mode compliant 

Transmission Distance:*0M(The actual distance is subject to the test environment)

Integrated Bluetooth low energy stack 

GAP, GATT, L2CAP, SMP Bluetooth low energy profiles 

Compliance: BQB BLE5.0, FCC, IC(Canada), CE ETSI RED…etc. worldwide RF Regulations. 

Transmit power :**1dBm~*5dBm typical

Receiver sensitivity: **7dBm typical 

In-System-Programmable Flash **8KB SRAM 8KB

*0 programmable GPIO

Programmable ARM Cortex-M3 processor for embedding full applications 

Low current consumption :Shutdown. No clocks running, no retention: **0nA(Typical)

 

Description

       HY**0R**4S1C integrates all features required for a Bluetooth Low power aplication ,which is a highly integrated Bluetooth 5.0 module targeted for low power Smart Devices and loT applications. HY**0R**4SICC also provides *0 programmable GPIO for low power product applications.

       HY**0R**4S1C offers all Bluetooth low energy features: radio, stack, profiles and application space for customer applications. The module also provides flexible hardware interfaces to connect sensors. 

       HY**0R**4S1C can be powered directly with a standard 3V coin cell batteries or pair of AAA batteries. 

       In lowest power shutdown mode it consumes only 0.*5uA and will wake up in few microseconds. 

       HY**0R**4S1C transmission distance of *0meter or more. (At face to face, free space, 1.2 Meter high from Ground for testing).

       Bluetooth IC:TTC***0R2 4*4*0.9mm *2pin IC,Used TI CC***0R2 die chip

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sophia < Shenzhen Shengrun Technology CO., Ltd >

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