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No. 435, Yongfeng Rd., Bade Dist.,Taoyuan City,Taiwan,Taiwan Taiwan
Features- Thermal conductivity: 15.0 W/m*K High compression rate Extremely low thermal impedance Typical Applications- Between CPU and heat sink.
Features- Thermal conductivity: 15.0 W/m*K High compression rate Extremely low thermal impedance Typical Applications- Between CPU and heat
Features- Thermal conductivity: 20.0 W/m*K High compression rate Extremely low thermal impedance Typical Applications- Between CPU and heat sink.
Features- Thermal conductivity: 11.0 W/m*K High compression rate Extremely low thermal impedance Typical Applications- Between CPU and heat
Features- Thermal conductivity: 3.0 W/m*K Excellent absorption characteristics Naturally tacky Reworkable Typical Applications- IC, CPU,
Features- Thermal conductivity:1.2W/m*K Excellent adhesive strength Designed for manufacture Excellent dielectric breakdown strength Ultra thin d
Features- Thermal conductivity: 5.0 W/m*K Hardness: Shore OO/55 Low dielectric constan Low oil-bleeding For high frequency applications Av
Features- Thermal conductivity: 3.0 W/m*K Hardness: Shore OO/50 Low dielectric constant Low oil-bleeding For high frequency applications A
Features- Thermal conductivity: 2.5 W/m*K Low mixing viscosity Extremely low Shrinkage rate 0.01%. Epoxy Based material with high hardness for sup
Features- Thermal conductivity: 3.5 W/m*K Bond Line Thickness: 100-1000 m Nonsilicone resin materials Designed to remove manufacturing tolerances
Contact Person Ms. Jessica Hung
Address No. 435, Yongfeng Rd., Bade Dist., Taoyuan City, Taiwan
We will contact you soon .
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