Product Description

 Features:

1,There are 3 independent heaters. The temperature, time, slope, cooling, alarming all can be displayed on the touch screen for easy to place repair motherboard.

2,The top heater can move freely along the X, Y axis. X-shaped infrared laser can do rapid location.

3,K-type thermocouple (closed loop), heating independently, temperature precision within ±1 degree, to got precise position.

4,The top heater device and mounting head 2 in 1 design and ball screw drive, with different size alloy BGA nozzles, customized is available; the top heater will be automatic run according settings.

5,High-definition CCD color imaging system, Joystick control.

6,Optical lens can be moved freely. It can observe all aspects of the BGA chip. X, Y axis and R angle with micrometer adjust accuracy within ±0.*1MM.

7,*5 TFT LCD Monitor; High automation, no human operations errors.

8,CE certification, with emergency switch and protective mesh.

9,It can save multiple groups profiles. You can analyze, set and calibrate the temperature parameters curve on the screen at any time.

*0,Cross-flow fan to cool the PCB board automatically to prevent the deformation of PCB board and ensure the welding effect;

*1,With Multifunctional and humanized operation interface. Equippedwith pressure and optical sensors to ensure not crush BGA chip; itcan repair Socket**5 and double BGA / CGA / IC and variousshielding devices, meet the requirement of lead-free process.