Product Description

item parameter Double-sided multilayer layer 2 ***2 copper thickness 0.5~4oz 0.5~4oz Board thickness 0.2~4.0mm 0.*0~5.2mm Flame retardancy *4V*0 *4V*0 Peel-off strength *2. 3N/cm *2.3N/cm warp ≦0.5% ≦0.5% insulation resistance ≧***1Ω ≧***1Ω Test voltage **0DCV ******0DCV Finished board size **0×**0mm **0×**0mm Min conductor width&space 0.*0/0.*0mm 0.*0/0.*0mm hole wall copper thickness ≧*5.0um(single point) ≧*5.0um(single point) Min welding ring Inner layer 0.*5mm Outer layer 0.**6mm 0.**6mm Min hole dia 0.*5mm 0.*0mm Hole tolerance PTH ±0.**6mm ±0.**6mm NPTH ±0.*5mm ±0.*5mm Shape tolerance ±0.**6mm ±0.**6mm Profile tolerance Routing ±0.*0mm ±0.*0mm Punching ±0.*3mm ±0.*3mm Green Solder Mask Bridge ≧0.*0mm ≧0.*0mm Soldermask hardness 6H 6H Solderability test **5℃ 5 secs **5℃ 5 secs Thermal shock ability **8℃ *0 secs **8℃ *0 secs Surface finish OSP, HAL, Immersion Gold﹐Gold Plating﹐Goldfinger OSP, HAL, Immersion Gold﹐Gold Plating﹐Goldfinger Quality standard IPC-A***0F, IPC-ML***0 IPC-A***0F, IPC-ML***0