Product Description

SIMOX extra thin film SOI wafers with box layer thickness <0.1um, diameter: 2' to 8' .

SOI wafers provide a manufacturing solution which helps reduce power and heat while increasing the speed performance of a device. They are widely used for the fabrication of micro electro mechanical system, micro optical devices, sensors, RF switches, power devices, and advanced CMOS IC chips.

SOI wafers are unique products which are often custom-built for specific end-user applications. BondaTek is able to meet customer's needs for SOI wafers with diameter from *6.2mm to **0mm. We accommodate SOI requests for development of small quantities as well as ongoing requirements.