Cirket Electronics Company

Specifications: Base material: FR4 Layers count: four Board thickness: 1.6mm Copper thickness: 1oz Surface finishing: immersion and gold finger

Specifications: Base material: FR4 Layers count: four Board thickness: 1.6mm Copper thickness: 1oz Surface finishing: immersion and gold finger

Base materials: FR4, aluminum, FPC and copper Minimum copper thickness: 0.5oz Maximum copper thickness: 4oz Minimum board thickness: 0.2mm Maximum

Base material: FR4 Layer count: double-sided board and single sided PCBBoard thickness: 1.6mm Copper thickness: 1oz Surface finish: immersion gold and

Industrial Power Supply PCB, SMT and DIP with 0201 Minimum Component,

Specifications: Base material: FR4 Layer count: double-sided board Board thickness: 1.2mm Copper thickness: 1oz Surface finish: HASL Soldermask color:

Specifications: Applicable PCB (L x W): 50 50 to 700 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA b

Base materials: FR4, aluminum, FPC and copper Minimum copper thickness: 0.5oz Maximum copper thickness: 4oz Minimum board thickness: 0.2mm Maximum boa