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fuyong,shenzhen,guangdong,China China
Min. Hole Diameter 0.5mm Min. Hole to Hole Tol. 1mil Min. L/Width L/spacing 4 mil Solder Mask Hardness
Shenzhen Hengtaida Technology Co, .Ltd deals in the development and production of printed circuit boards (PCB)
layer:Rigid 8Layers, Flexible 4Layers material PI+FR4 Board thickness: Rigid 1.0mm, Flexible 0.3mm Surface
layer:Rigid 4Layers, Flexible 1 Layers material PI+FR4 Board thickness: Rigid 1.6mm, Flexible 0.*5mm Surfac
layer:4 material FR4 TG**0 Board thickness: 0.6mm Surface finish immersion gold Min through hole 0.1mm(4m
layer:6 material FR4 Board thickness: 1.0mm Surface finish immersion gold Min through hole 0.1mm(4mil) Mi
layer:6 material FR4 Board thickness: 1.6mm Surface finish lead free HAL+gold finger Min through hole 0.1
layer:*2 material FR4 Board thickness: 1.6mm Surface finish flash gold Min through hole 0.1mm(4mil) Min l
used for medical area single side Min. Hole Diameter 0.2mm Min. L/W L/Spacing 3mil Min. Annular Ring Wid
layer:2 material FR4 Board thickness: 4.8mm Surface finish immersion silver Min through hole Min line
Contact Person Mr. sky xiong
Address fuyong, shenzhen, guangdong
We will contact you soon .
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