Shenzhen Prosper Dobond Technology Co., Ltd

LED sealant LCD Adhesive SMT Adhesive LED Underfilled Adhesive UV Adhesive Special Instant dry Adhesive

used in light-emitting diodes ( LED ) package high refractive index high light transmittance increase th

UV Adhesive for P+R low white environmental protection fast curing speed good maneuverability high effici

super glue **6B Almost suitable for all kinds of meterial room temperature curing fast curing for hard bon

High strength low viscosity for the M*6 following thread locking sealing the permanent prevent the screw

adhesive SMT Adhesive bonding electronic components low viscosity high flexibility low temperature curing

High temperature resistant High viscosity instant seal resistant to high temperature excellent solvent res

special for TPU+P lower odor nvironmental protection fast curing speed good maneuverability high efficie

especially for P+R low white one-component bonding material widely insensitive surface type fast curing

SMD Adhesive high and low power LED LED Chips patching high refractive index high light transmittance go

Treatment of **0 The **0 treating agent technical performance Product Code: **0 treatment agent Packaging

Underfill Adhesive BGA Glue filling of Mobile Phone s main board filling of Computer s main board fillin

especially for P+R This product is a cyanoacrylate low white low odor one-component fast curing

Our company&#*9;s solid crystal glue has high conductivity and high thermal conductivity characteristics,

special for P+R lower odor environmental protection fast curing speed good maneuverability high efficienc

Rapid solidification suitable for bonding metal and glass with accelerator LB***9 high intensity multipurpo

special for TPU+P lower odor environmental protection fast curing speed good maneuverability high effici

In 1, the main agent and hardening agent ratio 1: 1 ( volume ratio ) , when using , totally mixed, coated on t

underfilling adhesive flip chips one component Mainly for filling and protection after the CSP;BGA and UBGA