Description

X-ray mirror
Neutron mirror
Reflective optics for EUV lithography

Special Features

Ion beam sputtering system for precision optics.
Layer deposition and deposited layer milling, sequentially processed, with two ion guns.
Substrate rotation for uniform deposition.
Automatic distance control between ion guns and substrate.
Target rotated and linearly swept, for its uniform erosion.
Multilayer deposition with a low surface roughness(normally controlled below ~4Å)

Specifications

Wafer capacity : 1 x 4"
Dimension : 1,**0L × 2,**0H × **0W (mm3)
Power : 2 sets of ion guns(DC 1,**0V, **0mA)
Gas : Ar / N2
Pump: rotary(**0l/min) & turbo(2,**0l/s)
Heater : SiC heater 6"(Max. **0°C)
Power : DC 1.2kW
Loadlock system : single wafer loading
Control : LabView-based PC control