Product Description
The AW***1eR &
AW***3eR single-wafer dry etchers are automated tools designed as
a flexible *3.*6MHz RF Parallel Plate plasma etching systems for
high-volume wafer fabrication. AW***1eR & AW***3eR are in
direct response to manufacturers concerns for wafer breakage,
Uniformity, Uptime, Reliability, and Production-Proven
technology
AW***1eR /AW**3eR
Applications:
Polysilicon
Etch
Nitride
Etch
Silicon Nitride
Etch
Silicides
Etch
Silicon Dioxide
Etch
Polyimide
Etch
Polyimide ILD
Etch
LDD Spacer
Etch
BCB Etch
Zero Layer
Etch
Backside
Etch
Pad Etch
Passivation
Etch
Oxide/Contact/Via
Etch (Down to 0.8um)
Titanium/Tantalum
Alloy
Resist/SOG
Planarization
Descum
AW***1eR/ AW**3eR Key
Features:
Production-proven
plasma etching system.
Up to 3%*5%
Uniformity.
Frontside and
backside isotropic and anisotropic etch.
Process Temperature:
***5°C .
*5mm***0mm wafer
capability.
Integrated solid
robotic wafer handling. Single wafer process.
Fixed cassette
station and wafer aligner/cooling station.
Can handle *0um
thickness wafer.
PC controller with
Advanced Allwin*1 Software.
Endpoint detection
with Allwin*1 SLOPE technology. (Optional)
Up to 4 gas lines
with MFCs.
MKS *3.*6 MHz RF
Air-Cooled Generator **0W, **0W, or ***0W.
Pressure control with
UPC. Throttle valve is optional.
Touch screen
GUI.
EMO, Interlocks, and
Watchdog function.
GEM/SECS II
(Optional)
Small
Footprint
Made in
U.S.A.
AW***1eR/ AW***3eR Software Key
Features:
Real time graphics
display, process data acquisition, and analysis.
Closed-loop process
parameters control.
Precise parameters
profiles tailored to suit specific process
requirements.
Programmable
comprehensive calibration of all subsystems from within the
software. This allows faster, easier calibration, leading to
enhanced process results.
Recipe creation to
ensure process repeatability. It features a recipe editor to
create and edit recipes to fully automate the processing of
wafers inside the process chamber.
Validation of the
recipe so improper control sequences will be revealed.
Storage of multiple
recipes, process data, and calibration files so that process
& calibration results can be maintained or compared over
time.
Passwords provide
security for the system, recipe editing, diagnostics,
calibration, and setup functions.
Simple and easy to
use menu screen which allow a process cycle to be easily defined
and executed.
Troubleshooting
features which allows engineers and service personnel to activate
individual subassemblies and functions. More I/O and AD/DA
exposure.
DB**5F parallel
(printer) port. The computer interfaces to the Allwin*1
system with only one cable: the control interface
cable.
The control board
inside the machine that translates the computer commands to
control the machine has a watchdog timer. If this board loses
communication with the control software, it will shut down all
processes and halt the system until communication is
restored.
GEM/SECS II function
(Optional).
Advanced Allwin*1
Endpoint Detection function (Optional).
AW***1eR/ AW**3eR
Specifications:
Up to 6 inch
Capability
Throughput: ****0
WPH, Process Dependent
Temperature:
***5ºC (±2 ºC)
capability
Gas Lines: 4 gas
lines with MFCs.
Etcher Rate:
AW***1eR: *****0A/minute; AW***3eR: *****0A/minute, Process
Dependent
Uniformity: Up to
±3%, Process Dependent
Particulate: <0.*5
/cm2 (0.*3um or greater)
Selectivity: **1eR:
***0:1 ; AW***3eR: ***0:1, Process
Dependent
MTBF/MTTA/MTTR: **0
Hours/**0 Hours/3.5 Hours or Better. *5% uptime
* Contact Allwin*1
sales for other applications and specifications
AW***1eR/ AW***3eR
Configuration:
Main Frame,
Standard
Pentium Class PC with
AW Software
Keyboard, Mouse, USB
with SW backup, and Cables
Chuck
① 3; ② 4;
③ 5; ④ 6
Wafer Aligner/Cooling
Station
*-Axis
Integrated Solid
Robot
① H-Zero
(Standard); ② H**7X*0.5 (TTW)
Fixed Cassette
Station
Chuck
Assembly
① **1eR
Non-anodized; ② **3eR Anodized /W Flat
③ **3eR Anodized /wo
Flat ④ **3eR Non-anodized /W Flat
Reactor
Assembly
① **1eR
Non-anodized; ② **3eR Anodized
③ **3eR
Non-anodized; ④ **3eR High Performance
⑤ Direct
Cooling; ⑥
Non-Direct Cooling
Pins
① Quartz; ②
Ceramic; ③ SST
Centering
Ring
① Aluminum; ②
Quartz; ③ Ceramic
Main Control
Board
Gas Box /w 4 inline
Gas Lines, MFC, filters, and Pneumatic valves
RF Matching Network
with PCB
*3.*6 MHz RF
Generator (Air or Water Cooled)
① MKS
Elite:**0HD; ② MKS Elite:**0HD
③ MKS
Elite:***0HD; ④
ENI ACG
3; ⑤
ENI ACG *0
AC/DC Box
ATM Sensor
UPC Pressure
Control
① **5
SCCM,**1eR; ② ***0 SCCM, **3eR
MKS Baratron with
Pneumatic Isolation Valve
Main Vacuum
Valves
Front EMO,
Interlocks
**-inch Touch Screen
GUI
AW***1eR/ AW***3eR
Options:
EOP Module with
PCB
GEM/SECS II function
(Software)
Lamp tower alarm with
buzzer
Throttle Valve
Pressure Control
Vacuum
Pump
Chiller for chuck and
chamber
Through The
Wall
Plasma Etcher, Please Etching, Dry
Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor
Equipment, Semiconductor Process Equipment, Tegal **1e, Tegal
**3e, Tegal **1e TTW, Tegal **5
| Country: |
USA |
| Model No: |
AW-901eR AW-903eR Plasma Etch / RIE
|
| FOB Price: |
(Negotiable)
Get Latest Price
|
| Place of Origin: |
- |
| Price for Minimum Order: |
- |
| Minimum Order Quantity: |
1 |
| Packaging Detail: |
COntact us ***** for detail |
| Delivery Time: |
10 weeks |
| Supplying Ability: |
200 Piece per Year |
| Payment Type: |
T/T |
| Product Group : |
Plasma Etcher/RIE
|
