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dalian,dalian,liaoning,China China
we are one professional manufacturer of Die Bonder in China, and we supply semiconductor device with high accuracy at high speed. Model
UPH: 9000( 1mm* 1mm) Wafer: Max 8 inches 200mm Wafer Table 237.5237.5mm Chip Size: 0.2mm*0.2mm-2mm*2mm Application: Leadframes, PCB
Chip Size: 0.5mm .5mm 5mm mm Leak detection of chips & re-pick Bonding Accuracy: 80 m 20 ; Bonding Speed: UPH 4800 Wafer Size: max 8 i
we are a professional factory which maily focus on the PCB DESIGN, COMPONENTS PURCHASE, PCB ASSEMBLY, furthermore, we produce cog, die bonder etc. xx
Contact Person Ms. sheila wu
Address dalian, dalian, liaoning
We will contact you soon .
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