Description
Metal, ceramic, and alloy depositions for R&D in OLED
fields.
Special Features
Cluster sputtering system for TCO deposition with two sputtering
chambers and one glove box.
Robot transfer chamber between chambers and glove box.
Cassette loading type with glass holder.
Three tiltable 8" sputter guns and extra sputter gun ports in each
chamber.
Available in multilayer deposition as well as co-deposition.
Automatic control in substrate rotation and substrate to cathode
distance.
Precision mask aligner with laser focusing.
Substrate temperature uniformity : <±2% over **0x**0 glass.
<br /> System operation by PLC-based PC control.
Specifications
Glass Capacity : 5 × **0(mm3)
Dimension : 3,**0L × 2,**0H × 3,**0W(mm3)
Power : AC **0V, three phase for main
RF 3,**0W 2set for sputtering
DC 5,**0W 2set for sputtering
Heater : SiC coated graphite (Max. **0°C)
Gas : Ar/N2/O2/H2/C2H2
Pump : rotary(1,**0l/min) & TMP(**0l/s) for transfer
chamber
turbo(2,**0l/s, 2set) & dry pump(1,**0l/min 2 set) for main
chamber
